Assembly + Over-Molding

As component designers push to include greater functionality and reduced costs for componentry, over-molding silicone onto another substrate, insert or chemistry provides efficiencies over traditional assembly techniques. When over-molding is not an option due to temperature considerations or complexity of part designs, our team can develop a streamlined operation to adhere, test and package intricate assemblies or subassemblies.  For low surface energy substrates, adhesion strength can be increased with surface modification techniques leveraging primers and plasma or corona treatment solutions.

Common substrates suitable for over-molding include:

  • Substrate materials
    • Silicone
    • PEEK
    • Stainless Steel
    • Titanium blends
    • Polysulfone
    • PCBs
    • Teflon
  • Adhesion processes
    • Heat curable and RTV-based adhesive
    • Plasma etching
    • Priming

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